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What is the development trend of fiber optic jumper interface types?

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  • 发布时间: 2026-07-03

1、 The traditional interface iteration elimination route
ST and FC are gradually being marginalized
ST round head bayonet, FC threaded round head, the main force in LAN, broadcasting, and testing instruments in the early years;
Disadvantages: Large size, slow insertion and removal, low panel density;
Current situation: Only a small amount of equipment testing and renovation of old computer rooms are retained, and new network construction is basically no longer procured.
SC Big Head: Home broadband mainstay, data centers gradually shrinking
Advantages: Simple insertion and removal, low cost, standard configuration for FTTH in home optical modem;
Disadvantages: Large size, high-density cabinets are squeezed by LC;
Trend: Long term retention of home broadband and decreasing deployment of new IDC.
LC Xiaofangtou: Absolute Mainstream Data Centers in the Past 15 Years
Only half the size of SC, compatible with the full range of SFP/SFP+/OSFP optical modules;
Derived LC Uniboot integrated duplex jumper, saving space, preventing polarity reversal, and continuously upgrading;
Positioning: Based on long-term stock of medium and low-speed 10G/25G/100G, it will not be quickly phased out.
2、 Core Trend 1: Single core interface ultra miniaturization (VSFF ultra small size)
Targeting 800G/1.6T optical modules, we have launched VSFF extremely small shape connectors with a density 2-3 times that of LC:
SN connector: with a volume of approximately LC duplex 1/3, recommended by top manufacturers, compatible with OSFP/QSFP-DD high-speed modules;
MDC connector: a standardized product of US Conec, with a 3-fold increase in panel port density, and a batch pilot for supercomputing/intelligent computing centers;
Logic: The bottleneck of cabinet space forces single port to be smaller, and more high-speed ports should be plugged into the same panel.
3、 Core Trend 2: Multi core Integrated MPO/MTP Becomes Standard for High Speed Interconnection (Maximum Incremental Track)
Evolution Path
40G → 100G (12 core MPO) → 400G (16 core) → 800G/1.6T (24/32 core MPO) → Future 64 core high-density MT plug-in core
Core Motivation
The high-speed optical module adopts multi-channel parallel transmission, with a single MPO replacing more than ten LC jumpers, resulting in a 70% reduction in wiring volume;
AI computing power clusters, leaf spine networks, and pre terminated cabling for cabinets are essential, greatly improving cabling efficiency;
Deep adaptation of CPO co packaging optics and NPO near packaging optics, chip side optical interconnection cannot be separated from high-density MPO arrays;
trend
The number of MPO cores continues to increase, and MTP high-precision versions are gradually replacing ordinary MPO to reduce high-speed link insertion loss.
MPO multi-core connector
4、 Performance trend: ultra-low loss, precision end face
Insertion loss has gone from early 0.5dB to mainstream ≤ 0.2dB, with high-end precision connectors achieving within 0.1dB, suitable for ultra long distance single-mode high-speed transmission;
End face grinding process upgrade (APC/UPC differentiation refinement), stricter return loss index, and suppression of high-speed signal reflection;
Anti pollution and dust-proof structure with flip cover (E2000 improvement idea) are popularized in high-end telecommunications rooms to reduce operation and maintenance failures.
5、 Operation and maintenance trend: popularization of intelligent jumpers
The jumper is equipped with an RFID electronic tag, which automatically identifies the port, counts the link ledger, and quickly locates faults; Replacing manual labeling and reducing wiring inspection costs in ultra large data centers is a standard upgrade direction for large data centers.
6、 Summary of application scenario layering (pattern for the next 5 years)
Home broadband and PON access: SC is stable for a long time, almost unchanged
Enterprise ordinary data center, 25G/100G traditional network: LC (including Uniboot) continues to dominate
Cloud data center, 400G/800G conventional high-speed interconnection: LC+MPO hybrid deployment
AI intelligent computing center, 1.6T and ultra high speed cluster, CPO scenario: VSFF (SN/MDC)+high core MPO becomes the new mainstream
Old broadcasting, equipment, and renovation projects: a small number of FC/ST are being phased out and eliminated

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